A view of Jaewon facilities. A domestic company has recently developed new process chemicals that can be applied to the increasingly popular semiconductor 'glass substrates (glass cores)'. Jaewon Industry (CEO Shim Jaewon) announced on the 21st that they have developed three additives for Through-Glass-Via (GTV) plating as new process chemicals for glass substrates. These additives have been supplied to domestic substrate manufacturers, where performance evaluations have been completed, and they are currently undergoing verification for mass production applicability and commercialization. Glass substrates represent a new trend, significantly aiding in the growth of the heterogeneous package market. With the emergence of on-device artificial intelligence (AI), there is increasing demand for high-performance semiconductor modules, driving the rapid growth of the 'heterogeneous' package market. However, heterogeneous bonding technology requires incorporating various types of chips on a substrate, which necessitates an increase in substrate area...